6 pin clcc, 7x5, 2.54p case 848AB-01 issue c date 17 dec 2007 scale 2:1 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. a b e d bottom view b e 6x 0.10 b 0.05 a c c 0.15 c terminal 1 indicator top view a a1 a3 0.10 c c seating plane side view l 6x 1 2 5 6 d3 dim a min nom max millimeters 1.70 1.80 1.90 a1 0.70 ref b 1.30 1.40 1.50 d1 6.17 6.20 6.23 d2 6.66 6.81 6.96 e1 4.37 4.40 4.43 r 0.70 ref l 1.17 1.27 1.37 a2 0.36 ref a3 0.08 0.10 0.12 d 7.00 bsc d3 5.08 bsc e 5.00 bsc e2 4.65 4.80 4.95 e3 3.49 bsc e 2.54 bsc d1 e1 d2 e2 a2 3 4 e3 r 4x xxxxxxxxx xxxxxxxxxxxxx awlyywwg 1 generic marking diagram* xxxxx = specific device code a = assembly location wl = wafer lot yy = year ww = work week g = pb-free package *this information is generic. please refer to device data sheet for actual part marking. pb-free indicator, g or microdot , may or may not be present. *for additional information on our pb-free strategy and soldering details, please download the on semiconductor soldering and mounting t echniques reference manual, solderrm/d. soldering footprint* pitch 2.54 1.50 6x 5.06 1.50 6x dimension: millimeters h h 1.80 ref mechanical case outline package dimensions http://onsemi.com 1 ? semiconductor components industries, llc, 2002 october, 2002 - rev. 0 case outline number: xxx document number: status: new st andard: description: 98aon23467d on semiconductor standard 6 pin clcc, 7x5, 2.54p electronic versions are uncontrolled except when accessed directly from the document repository. printed versions are uncontrolled except when stamped controlled copy in red. page 1 of 2
document number: 98aon23467d page 2 of 2 issue revision date o released for production. req. by c. rebello. 20 oct 2006 a corrected device marking. req. by c. rebello. 13 mar 2007 b revised device marking. req. by c. rebello. 05 sep 2007 c added bevels to sides of package on top and bottom views. added h dimension. req. by p. celaya. 17 dec 2007 ? semiconductor components industries, llc, 2007 december, 2007 - rev. 01c case outline number: 848ab on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, in cluding without limitation special, consequential or incidental damages. typical parameters which may be provided in scillc data sheets and/or specifications can and do vary in different a pplications and actual performance may vary over time. all operating parameters, including typicals must be validated for each customer application by customer's technical e xperts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc prod uct could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indem nify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was neglig ent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner.
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